Molybdenum Plate Sputtering Target
The thickness of molybdenum plate sputtering target is from 0.09 inch to 3 inch.
Appearance: silver gray with metal luster
Specification (mm): above BCM=9.9（0.3-10）（60-400）800
Content: molybdenum content: 99.95%~99.6%,impurities content: ≤0.04%
Density: 10.2g/ m3
Properties: high melting point, high conductivity, low specific impedance, great corrosion resistance and environmental friendly material.
Production processes: molybdenum powder (raw-material)-pressing—sintering-inspecting-hot rolling-levelling and annealing-alkali washing-proceeding-packing-deliver
Application: molybdenum plate sputtering target was widely used in mould and furnace parts building, electron industry and semiconductor industry’s components production, vacuum furnace, heating furnace and thermal insulation material’s plate electrode and other fields.
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